Optimized for secondary optics
A reduced optical source supports controlled, high-candela beams in compact directional lighting systems.
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Flashlight
LED
Driver
Battery
Charger
Accessory
Attachment
Other
USD
USD($)
EUR(€)
AUD(AUD)
CAD(CA$)
GBP(£)
SGD(S$)
NZD(NZ$)
JPY(円)
RUB(₽)
GHS(₵)
RON(L)
ARS(ARS$)
COP(COP)
PEN(S/.)
VND(₫)
NGN(₦)
SAR(S.R.)
TRY(₺)
CLP(CLP)
ZAR(R)
HKD(HK$)
BRL(R$)
KRW(₩)
MYR(RM)
IDR(Rp)
DKK(Dkr)
CZK(Kč)
CHF(CHF)
TWD(NT$)
THB(฿)
SEK(Kr)
PLN(zł)
PHP(₱)
NOK(Kr)
MXN(MXN$)
ILS(₪)
HUF(Ft)
CNY(¥)
High-Intensity SMD LED
A compact, high-intensity LED engineered for strong candela and precise beam control through secondary optics—ideal for portable and directional lighting designs.
Focused performance
XP-L HI combines a small light-emitting surface with high single-die output, helping optical systems achieve tighter beams, longer throw and efficient use of reflectors or lenses.
A reduced optical source supports controlled, high-candela beams in compact directional lighting systems.
The 3.45 × 3.45 mm package simplifies integration where board space and optical alignment both matter.
Low junction-to-solder thermal resistance helps move heat into the PCB when paired with a properly designed thermal system.
Available across 2700–6500 K with multiple CRI options for different beam, color and application requirements.
Reflow-solderable construction supports automated assembly and scalable manufacturing workflows.
Compliance documents and material declarations can be supplied for supported part numbers and production batches.
Technical overview
Values below describe the XP-L HI product family. Final performance depends on the complete order code, flux bin, CCT, CRI, junction temperature and thermal design.
| Package size | 3.45 × 3.45 mm |
|---|---|
| Maximum DC drive current | 3000 mA |
| Forward voltage | 2.79 V typical; 3.25 V maximum at 1050 mA, Tj = 85 °C |
| Viewing angle | 115° typical, FWHM |
| Thermal resistance | 0.5 °C/W, junction to solder point |
| CCT range | 2700–6500 K, order-code dependent |
| CRI options | <70, 70, 80 and 90, depending on order code |
| Maximum junction temperature | 150 °C |
| Assembly | Surface mount; reflow solderable |
| Thermal path | Electrically neutral |
Applications
Contact us with your target CCT, CRI, flux bin, quantity and application. Samples are recommended before volume production.
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