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XPL HI LED

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BIN
XPLAWT-H-1D0-V40-1B-0005
XPLAWT-H-3A0-V40-1L-0005
XPLAWT-H-5C1-V20-1H-0005
XPLAWT-H-7A3-U40-0H-0001
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  • Detail

    High-Intensity SMD LED

    XPL HI LED

    A compact, high-intensity LED engineered for strong candela and precise beam control through secondary optics—ideal for portable and directional lighting designs.

    3.45 mmSquare package
    3.0 AMaximum drive current
    115°Typical viewing angle
    0.5 °C/WJunction-to-solder thermal resistance

    Focused performance

    High intensity from a compact optical source

    XP-L HI combines a small light-emitting surface with high single-die output, helping optical systems achieve tighter beams, longer throw and efficient use of reflectors or lenses.

    01

    Optimized for secondary optics

    A reduced optical source supports controlled, high-candela beams in compact directional lighting systems.

    02

    Compact XP footprint

    The 3.45 × 3.45 mm package simplifies integration where board space and optical alignment both matter.

    03

    Efficient thermal path

    Low junction-to-solder thermal resistance helps move heat into the PCB when paired with a properly designed thermal system.

    04

    Flexible white-light options

    Available across 2700–6500 K with multiple CRI options for different beam, color and application requirements.

    05

    Production-ready SMD format

    Reflow-solderable construction supports automated assembly and scalable manufacturing workflows.

    06

    Order-specific documentation

    Compliance documents and material declarations can be supplied for supported part numbers and production batches.

    Technical overview

    Series reference specifications

    Values below describe the XP-L HI product family. Final performance depends on the complete order code, flux bin, CCT, CRI, junction temperature and thermal design.

    Package size 3.45 × 3.45 mm
    Maximum DC drive current 3000 mA
    Forward voltage 2.79 V typical; 3.25 V maximum at 1050 mA, Tj = 85 °C
    Viewing angle 115° typical, FWHM
    Thermal resistance 0.5 °C/W, junction to solder point
    CCT range 2700–6500 K, order-code dependent
    CRI options <70, 70, 80 and 90, depending on order code
    Maximum junction temperature 150 °C
    Assembly Surface mount; reflow solderable
    Thermal path Electrically neutral

    Applications

    Built for controlled, directional light

    • High-performance flashlights
    • Headlamps and bike lights
    • Spotlights and search lights
    • Portable work lights
    • Outdoor directional lighting
    • Compact optical modules

    Match the LED to your optical and thermal design

    Contact us with your target CCT, CRI, flux bin, quantity and application. Samples are recommended before volume production.

    Contact Sales
    Specifications are series reference values and remain subject to the selected part number, production batch and latest supplier documentation. Confirm all electrical, optical and compliance requirements before ordering.
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